Course ID 00830656
Course format ILT
Course length 3 day(s)
Skill level Expert
Delivery languages English
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Course description

This course provides instruction on HP BladeSystem administration and management. It includes discussion of the portfolio overview including components, configurations, and solutions.

Who should attend

System administrators, engineers and consultants who will manage and monitor the HP ProLiant BladeSystem c-Class environment.

Prerequisites

HP recommends that you have attained the following credentials or levels of experience before taking this course:
• Introduction to HP ProLiant Servers (HE643S) or similar experience is recommended.

Topics

  • Module 1: HP BladeSystem portfolio introduction
    • Identify resources for information about the current HP c-Class BladeSystem portfolio
    • Differentiate the two types of HP BladeSystem enclosures
    • Identify HP BladeSystem ProLiant servers
    • Identify HP Integrity server blades
    • Describe other components in the c-Class portfolio including HP BladeSystem adapters and mezzanines, HP BladeSystem interconnects, and HP BladeSystem c-Class options
    • Define the warranty and support options for HP BladeSystem solutions
  • Module 2: HP BladeSystem c-Class enclosures
    • Describe the HP BladeSystem c-Class enclosures
    • Describe the c-Class enclosure structure
    • Explain c-Class enclosure signal pathing for installing mezzanines and interconnects in the correct locations
    • Define an enclosure numbering scheme
    • Explain how to access the HP Onboard Administrator
  • Module 3: HP BladeSystem power and cooling
    • Explain how to configure power for an HP BladeSystem c-Class enclosure
    • Explain how to control power in a c-Class enclosure
    • Describe HP intelligent location and power discovery services
    • Describe the structural cooling components and features
  • Module 4: HP BladeSystem c-Class servers
    • Identify the distinctions between the HP ProLiant G7 and Gen8 servers
    • Describe the technologies on the ProLiant system board: Mezzanines USB and SD cards, Embedded LOM and FlexibleLOM
    • Identify c-Class Integrity servers and their requirements
  • Module 5: HP BladeSystem c-Class storage, tape, and expansion blades
    • Describe how the HP BladeSystem c-Class enclosure architecture enables partnering of server blades with storage or expansion blades
    • Explain the placement rules and installation guidelines for storage and expansion blades
    • Describe the features and components of: Storage blades, Tape blades, and Expansion blades
  • Module 6: HP BladeSystem c-Class connectivity options
    • Describe the HP BladeSystem c-Class interconnect module architecture
    • List the BladeSystem c-Class interconnect modules: Ethernet, Fibre Channel, InfiniBand, and SAS
    • Describe the mezzanine cards and slots available in the BladeSystem c-Class server blades
    • Describe HP BladeSystem c7000 and c3000 enclosure port mapping
  • Module 7: HP Virtual Connect overview
    • Define the benefits of HP BladeSystem solutions with HP Virtual Connect technology
    • Describe Virtual Connect technology and its main components
    • Identify ways to use Virtual Connect technology in a data center
    • Describe the VC Flex technology
    • Describe the VC FlexFabric Fibre Channel storage with 3PAR solution
  • Module 8: HP BladeSystem c7000 enclosure and infrastructure installation and management
    • List the steps for planning an HP BladeSystem c7000 enclosure installation
    • Explain the process for installing the c7000 enclosure components
    • List the initial steps involved in setting up the c7000 enclosure using the: HP Insight Display Initial Setup Wizard and the HP Onboard Administrator (OA) First Time Setup Wizard
    • Describe the OA management features
    • Describe the HP BladeSystem c-Class enclosure power and thermal monitoring
  • Module 9: HP BladeSystem c-Class firmware
    • Determine what firmware is embedded in various components in the enclosure and how to update it
    • Explain how to access the HP SPP download and documentation
    • Describe how to update firmware for the HP OA using: HP SUM EFM
    • Explain how to implement HP BladeSystem c-Class enclosure firmware
    • Explain how to update firmware embedded in the OA for a blade enclosure

Objectives

After completing this course, you should be able to do the following:
  • Identify information resources for current HP c-Class BladeSystem portfolio.
  • Differentiate between the two types of HP BladeSystem enclosures.
  • Identify HP BladeSystem ProLiant servers and HP Integrity server blades.
  • Describe other components in the c-Class portfolio:
    - HP BladeSystem adapters and mezzanines
    - HP BladeSystem interconnects HP BladeSystem c-Class options
  • Define the warranty and support options for HP BladeSystem solutions.
  • Describe the HP BladeSystem c-Class enclosures.
  • Describe the c-Class enclosure structure.
  • Explain c-Class enclosure signal pathing for installing mezzanines and interconnects in the correct locations.
  • Define an enclosure numbering scheme.
  • Explain how to access the HP Onboard Administrator.
  • Explain how to configure power for an HP BladeSystem c-Class enclosure.
  • Explain how to control power in a c-Class enclosure.
  • Describe HP intelligent location and power discovery services.
  • Describe the structural cooling components and features.
  • Identify the distinctions between the HP ProLiant G7 and Gen8 servers.
  • Describe the technologies on the ProLiant system board:
    - Mezzanines USB and SD cards
    - Embedded LOM and FlexibleLOM
  • Identify c-Class Integrity servers and their requirements
  • Describe how the HP BladeSystem c-Class enclosure architecture enables partnering of server blades with storage or expansion blades.
  • Explain the placement rules and installation guidelines for storage and expansion blades.
  • Describe the features and components of: Storage blades, Tape blades, Expansion blades
  • Describe the HP BladeSystem c-Class interconnect module architecture.
  • List the BladeSystem c-Class interconnect modules: Ethernet, Fibre Channel, InfiniBand, SAS
  • Describe the mezzanine cards and slots available in the BladeSystem c-Class server blades.
  • Describe HP BladeSystem c7000 and c3000 enclosure port mapping.
  • Define the benefits of HP BladeSystem solutions with HP Virtual Connect technology.
  • Describe Virtual Connect technology and its main components.
  • Identify ways to use Virtual Connect technology in a data center.
  • Describe the VC Flex technology.
  • Describe the VC FlexFabric Fibre Channel storage with 3PAR solution.
  • List the steps for planning an HP BladeSystem c7000 enclosure installation.
  • Explain the process for installing the c7000 enclosure components.
  • List the initial steps involved in setting up the c7000 enclosure using the: HP Insight Display Initial Setup, Wizard HP Onboard Administrator (OA), First Time Setup Wizard.
  • Describe the OA management features.
  • Describe the HP BladeSystem c-Class enclosure power and thermal monitoring.
  • Determine what firmware is embedded in various components in the enclosure and how to update it.
  • Explain how to access the HP SPP download and documentation.
  • Describe how to update firmware for the HP OA using: HP SUM EFM.
  • Explain how to implement HP BladeSystem c-Class enclosure firmware.
  • Explain how to update firmware embedded in the OA for a blade enclosure.

How to register

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Policies, fees and cancellations

Course fees may vary and are established and collected by the training center delivering the course. Cancellation fees may apply. Contact your HP Authorized Training Partner for their respective policies.